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U.S. and Taiwan Sign Historic $500 Billion Semiconductor Reshoring Agreement

A landmark trade deal aims to restore American chip manufacturing leadership through massive Taiwanese investment and strategic tariff rewards.

A landmark trade deal aims to restore American chip manufacturing leadership through massive Taiwanese investment and strategic tariff rewards.

A landmark trade deal aims to restore American chip manufacturing leadership through massive Taiwanese investment and strategic tariff rewards.

NewDecoded

Published Jan 16, 2026

Jan 16, 2026

3 min read

Image by Roméo A.

The American Institute in Taiwan and the Taipei Economic and Cultural Representative Office signed a landmark trade agreement on January 15, 2026. This historic pact triggers a massive reshoring of the semiconductor industry to the United States. It forms a central part of the Freedom 250 initiative to restore American technological independence and industrial strength.

Taiwan has committed to at least $250 billion in direct investments to build advanced semiconductor and artificial intelligence production facilities on American soil. The Taiwanese government will also provide $250 billion in credit guarantees to support the movement of the entire supply chain ecosystem. World-class industrial parks will be established to foster innovation and next-generation manufacturing clusters across the country.

The agreement establishes a predictable tariff framework where reciprocal rates are capped at 15 percent for general goods. A unique investment reward system allows Taiwanese firms to import chips duty-free at 2.5 times their planned U.S. capacity during factory construction. This mechanism ensures supply stability while domestic manufacturing capacity is actively being built, as detailed in the official fact sheet.

Beyond economic incentives, Taiwan secures expanded access to critical American markets including defense technology, biotechnology, and telecommunications. This partnership creates a trusted loop of technological collaboration and deepens U.S. investment in Taiwan’s emerging sectors. Both nations aim to strengthen leadership in high-stakes fields like artificial intelligence and secure communications through these shared resources.

This whole-of-government effort addresses the long-term decline of U.S. wafer fabrication, which dropped from 37 percent in 1990 to under 10 percent recently. By anchoring production within the United States, the administration aims to end reliance on brittle global supply chains and foreign industrial policies. The deal positions the U.S. as a potential net exporter of advanced logic chips by the next decade.


Decoded Take

Decoded Take

Decoded Take

This agreement represents a fundamental pivot from traditional subsidies to a trade policy that requires physical relocation of critical infrastructure. By tying tariff relief and import quotas directly to the construction of American factories, the administration effectively makes U.S. soil the mandatory center for high-end logic chips. While this move strengthens national security and creates significant industrial capacity, it also signals a deliberate decoupling from adversarial supply chains. This strategy ensures that the next generation of artificial intelligence and defense technology is born within a secure, western-aligned environment.

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