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Feb 19, 2026
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NewDecoded
3 min read
DayOne Data Centers Limited announced on January 5, 2026, that it has secured over US$2.0 billion in Series C equity financing. This major capital raise was led by the global investment firm Coatue and supported by the Indonesia Investment Authority. The funds are designated to accelerate the next phase of the company's international expansion, specifically targeting high-density and AI-ready digital infrastructure. The financing round was priced at a 100 percent premium over the company’s previous valuation, demonstrating strong investor appetite. This latest injection brings the total capital raised by DayOne Data Centers to nearly US$5 billion within the last two years. The firm currently manages a secured development pipeline of approximately 1GW to meet the needs of global technology leaders.
In Europe, the new capital will advance hyperscale projects in Lahti and Kouvola, Finland. These campuses are designed to be the foundation of a sustainable Nordic platform, utilizing district heating to recycle waste heat and relying on renewable energy. The Lahti site alone represents a projected investment of €1.2 billion with a potential capacity of 128MW.
Expansion in the Asia-Pacific region will focus on the SIJORI growth corridor, which links Singapore, Johor, and Batam. The company is also scaling its footprint in Japan and Thailand, including a massive 1GW potential platform in Chonburi. These locations are strategically selected to balance high connectivity with sustainable power and land availability.
CEO Jamie Khoo noted that the investment reflects deep confidence in the platform's quality and its rapid growth trajectory. She emphasized that as demand for AI and cloud infrastructure accelerates, customers require partners capable of delivering with both scale and speed. DayOne utilizes prefabricated construction models to deploy new capacity up to 30 percent faster than traditional building methods.
The platform is engineered to support the thermal requirements of next-generation GPU clusters through liquid-cooling readiness. By leveraging partnerships with sovereign funds and utility providers, the company is bypassing traditional grid constraints with innovations like solid oxide fuel cells. This positioning reinforces DayOne’s role as a critical enabler for the global technology ecosystem.
The US$2.0 billion Series C marks a transition for DayOne from a regional specialist to a global hyperscale heavyweight. By securing 1GW of commitments, the company is moving from asset accumulation to massive delivery in the race for AI dominance. The focus on AI-ready liquid cooling and the geographical axis between Southeast Asia and the Nordics addresses the industry's two biggest bottlenecks: power availability and heat management. This suggests that the future of digital infrastructure will be defined by modular speed and sustainable integration rather than just raw real estate.